| Non-Hermetically Sealed
Devices |
| A pressurized steam
environment is used to evaluate the reliability of solid
state devices. |
| Typical test
specifications include: |
JESD22-A101 Reliability of non-hermetically packaged
solid state devices |
|
JESD22-A102 Accelerated Moisture Resistance |
|
JESD22-A110 Highly Accelerated Temperature and Humidity
Test |
| Electronic Components |
| Electronic
components are steam aged to simulate shelf aging prior
to solderability testing. |
| Typical
test specifucations include: |
|
MIL-STD-202 |
MIL-STD-883 |
| Industrial Devices |
|
Valves |
Condensate Traps |
